Engineering Topic

How Should Film Thickness for Lamination Be Chosen?

Thickness is the direct lever between cost and performance: too thin brings pinholes and bonding failures, too thick raises cost and wrinkles in deep corners. Back-calculate the minimum from the barrier target.

Thickness measurement (placeholder)

Thickness Essentials

Back-calculate from barrier

Derive minimum functional thickness from the target WVTR/OTR.

Pinhole floor

Below 25–30 µm, pinhole risk rises sharply.

Add margin for deep draw

Areas with high stretching need compensating thickness.

Uniformity matters equally

±10% thickness tolerance is the production standard.

Thickness Selection Reference

Starting values; adjust from barrier and forming tests.

Standard trays30–50 µm (EVOH 80–100 µm)
Deep-draw trays50–100 µm (EVOH 100–150 µm)
Barrier laminatesFunctional layer: EVOH 5–15% share
Pinhole-risk floor25–30 µm
Thickness toleranceWithin ±10%
MeasurementASTM D6988 / inline gauging

Thickness FAQ

Is thicker always more moisture-proof?

Broadly yes, but cost rises linearly — use the WVTR target as the guide, not maximization.

Can we start thin and fix it later?

Pinhole leaks can't be patched online — the starting thickness must carry margin.

How to keep thickness uniform?

Choose film supply and equipment with inline gauging and closed-loop thickness control.

Need an Assessment for Your Application?

Share your tray geometry, application and performance requirements — a DNW engineer will help evaluate film structure and process parameters.

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